The Georgia Tech 3D Systems Packaging Research Center is unique in
three ways. It goes beyond the traditional exploratory research by
faculty and graduate students to an integrated and system level
approach with particular focus on: 1) leading-edge electronic and
bio-electronic systems research, 2) cross-discipline education of
students, and 3) industry collaborations with more than 70 companies
from the U.S., Europe and Asia all in one transformative systems
technology called System-On-Package, pioneered by the Center.